SiC Abrasive Paper, Non-Adhesive
SiC Wet Grinding Paper non‑adhesive – flexible, economical, proven
SiC wet grinding paper with paper backing: quick changes, clear processes, clean scratch patterns
Wet grinding with silicon carbide (SiC) on a paper backing is the classic, cost‑efficient solution for metallographic preparation. Change grits in seconds, choose the right fixation for your machine, and achieve reproducible results — from rough grinding to fine finish.
Why paper backing?
- Fastest changeover for frequent grit changes
- Flexible fixation: clamping ring, double‑sided adhesive film, spray adhesive, magnetic carrier plates
- Economical in procurement and storage
- Reproducible scratch patterns across all standard grits
Suitable materials
- Non‑ferrous metals (aluminum, copper alloys, titanium), steels (structural, stainless, high‑alloy CrNi steel, tool steels)
- Plastics and mounting compounds, fiber composites (CFRP/GFRP)
- Note: For short‑chipping, very hard/brittle materials (carbide, ceramics, glass) we recommend diamond solutions.
Sizes, grits, availability
- Diameters: Ø 200, 230, 250, 300 mm from stock; Ø 305/350 mm on request
- Typical grits: P60, P80, P120, P180, P220, P320, P400, P500, P600, P800, P1000, P1200, P2500, P4000; very fine steps available to order
- Packaging: 50 or 100 sheets depending on grit
- Manufacturers: Hermes, Starcke — FEPA‑P compliant, narrow grit ranges, consistent batch quality [26]
Fixation and system compatibility
- Clamping ring: fast standard for paper
- Double‑sided adhesive film / spray adhesive: on metal carrier plate; insert magnetically or with mechanical clamping
- Magnetic carrier plates: fast changeover, smooth run, good flatness even with paper
Tip: Select fixation based on cycle time, operator preference, and machine. We are happy to advise.
Practical guide — wet grinding workflow
- Rough grinding (P80–P180)
Reliably remove saw marks/deformation, fast material removal. - Intermediate grinding (P240–P600)
Homogenize scratches, reduce roughness in a controlled way. - Fine grinding (P800–P1200; optionally finer)
Polishable, uniform surface; optionally P2500/P4000 before final polishing.
Recommendations:
- Continuous water supply for cooling and debris removal
- Moderate contact pressure; typical speed 150–400 rpm depending on material/Ø
- Run each step until the previous scratch pattern is fully replaced
Comparison with alternatives
- Paper backing (non‑adhesive): fastest changeover, flexible, cost‑effective — ideal with high change frequency
- Film backing (SiC with film): highest flatness/service life — for reproducible series with fewer changes
- Self‑adhesive (PSA): convenient for low annual consumption, clear takt, slightly longer change time [3]
Complementary products & accessories
- SiC with film backing: dimensionally stable, long service life
- SiC grinding paper self‑adhesive: easy handling, clear takt
- Accessories: double‑sided adhesive film, spray adhesive, magnetic carrier plates
- Polishing & finish: diamond suspension, diamond paste, polishing cloths
FEPA‑P quick reference (excerpt)
- P80 ≈ 201 µm — rough/plane grinding
- P320 ≈ 46 µm — intermediate grinding
- P600 ≈ 26 µm — fine intermediate grinding
- P1200 ≈ 15 µm — fine grinding finish
- P2500/P4000 ≈ 8/7 µm — ultra‑fine grinding before polishing
You can find the complete FEPA table with grit size comparison on our homepage.
Consulting and ordering
We align grit sequence, fixation, and accessories with your cycle and machine.
- Phone: +49 (0)2407 568296‑0
- Email: info@schmitz-metallographie.de
- Schmitz‑Metallographie GmbH